Benefits

The value of each benefit to an individual varies depending on their efforts and priorities, but in sum, the benefits far outweigh the efforts devoted to participation.

Here’s what one member believes are the benefits of his membership in TTTC:

  • TTTC is a valuable source of technical information for any technical professional directly or indirectly involved with testing.
  • TTTC is a network of testing professionals sharing valuable know-how and experience.
  • TTTC gives professionals an opportunity to meet and work with the leaders of the testing industry.
  • >TTTC is a prime source of information about conferences, symposia, workshops and tutorials dealing with test.
  • TTTC gives technical professionals an opportunity to broaden their managerial, interpersonal, and leadership skills through participation in the management of a technical meeting, TAC, or TTTC itself.
  • >TTTC offers an opportunity to influence the development of test techniques and standards that impact our society which is very dependent on electronic technology.
  • TTTC offers a source of professional contacts that could provide potential career advancement or fulfill a need for new employment.
  • TTTC provides the potential steppingstones to a position of leadership> in the testing community.
  • TTTC helps bridge academic and industrial work.

ID-100127319

 

Upcoming conferences and symposia

IEEE VLSI Test Symposium (VTS) 2026
Submission deadline: December 5, 2025
Notification: January 24, 2026
Camera-ready upload: February 28, 2026
Conference: April 27-29, 2026

IEEE European Test Symposium (ETS) 2026
Submission of title, abstract, authors: 15 December 2025
Full paper submission: 12 January 2026
Notification of acceptance: 20 February 2026
Camera-ready manuscript: Deadline: 22 March 2026
Conference: May 25-29, 2026

IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS) 2026

Submission of title, abstract, and authors: March 1, 2026
Final Paper Submission: March 8, 2026
Author Notification: April 12, 2026
Conference Dates: July 1 – 3, 2026

International Test Conference (ITC) 2026
Paper title/abstract due: March 20, 2026
Paper final PDF due: April 24, 2026
Author notification: June 19, 2026
Conference Dates: October 11 to 16, 2026

IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS) 2026
Title and abstract submissions April 24th, 2026
Full paper submissions May 1st, 2026
Notification July 10th, 2026
Camera ready and author’s registration July 24th, 2026