Technical Activity Committee on RF Testing

TAC Chair:

Iboun Taimiya SYLLA, isylla@ti.com

The rapid growth in the Wireless communication market has introduced many challenges to the IC design and test community. On one hand, in order to keep up with the market trend, design engineers must be able to produce highly integrated circuits; and on the other hand the test community has the challenge of producing innovative test solutions for these ICs that are more and more combining test challenge of digital, Mixed-Signal and RF. Many questions remained unanswered while operating in RF and Microwave domain.

Among those questions two are the most famous:

• What should be the overall test strategy for that type of circuits and system?
• Should we change our mindset when testing RF circuits and systems?

The scope of this Committee is to initiate actions that will help test engineers understand and answer these questions, and help them tackle the challenges lying ahead.

Through the RF Test topics at International Test Conference and within The Wireless Test Workshop the Committee is participating to create a vast forum of RF test solutions developers. The Committee is exploring other Activities that might enhance RF testing.