TTTC's Electronic Broadcasting Service
DATE 2014 Friday Workshop
Held in conjunction with DATE 2014
CALL FOR PAPERS
The Design, Automation, and Test in Europe conference and exhibition is the main European event bringing together researchers, vendors and specialists in hardware and software design, test and manufacturing of electronic circuits and systems. Friday Workshops are dedicated to emerging research and application topics. At DATE 2014, one of the Friday Workshops is devoted to 3D Integration. This one-day event consists of a plenary keynote, regular and poster presentations, and a panel session.
3D Integration is a promising technology for extending Moore’s momentum in the next decennium, offering heterogeneous technology integration, higher transistor density, faster interconnects, and potentially lower cost and time-to-market. To produce 3D chips, new capabilities are needed: process technology, architectures, design methods and tools, and manufacturing test solutions. The goal of this Workshop is to bring together researchers, practitioners, and others interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges. Previous editions of this workshop took place in conjunction with DATE 2009, DATE 2010, DATE 2011, DATE 2012 and DATE 2013.
You are invited to participate and submit your contributions to the DATE 2014 Friday Workshop on 3D Integration. The areas of interest include (but are not limited to) the following topics:
|Submissions are invited in the form of (extended) abstracts not exceeding two pages and must be sent in as PDF file to <firstname.lastname@example.org> and <email@example.com> with “DATE14-3D-WS” as subject. All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, and technical soundness. Selected submissions can be accepted for regular or poster presentation. At the workshop, an Electronic Workshop Digest will be made available to all workshop participants, which will include all material that authors are willing to provide: abstract, paper, slides, poster, etc.|
Paper Submission deadline: December 9, 2013
Saqib Khursheed – General Chair
Pascal Vivet – Program Co-Chair
Fabian Hopsch – Program Co-Chair
Steering Committee Members
For more information, visit us on the web at:
The DATE 2014 Friday Workshop on 3D Integration Applications, Technology, Architecture, Design, Automation, and Test is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).
IEEE Computer Society- Test Technology Technical Council
1ST VICE CHAIR
ITC GENERAL CHAIR
EAST & AFRICA
PRESIDENT OF BOARD
TTTC 2ND VICE CHAIR
IEEE DESIGN & TEST EIC