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TTTC's
Electronic Broadcasting Service |
2nd IEEE International Workshop on
Held in conjunction with Test Week (International Test Conference 2010) |
Submission Deadline Extended to October 8, 2010! |
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CALL
FOR PAPERS |
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In IC designs today, analog content is no longer a small portion of silicon as it was in the past. With various interfaces such as PCIe, DDR, Display-IO, HT, and other components such as PLLs, DACs, Temperature Sensors, the proportion of silicon die area covered by analog circuits is continually increasing with each design generation. Starting with 65nm process technology, a growing market need for high speeds, large bandwidths and small geometries have made designs a lot more complex in terms of testability and manufacturability. Majority of test for analog portions of a chip have been marginalized to characterization on the ATE and boards. This characterization is often planned around various electrical and thermal corners and the outcome is heavily dependent on process technology. More often than not, rigorous testing of the full range of properties of an analog circuit is neglected during production-ramp and production. Prime among the many reasons for this lack of rigor in test of analog circuits is overall test cost. In this workshop, we will bring to fore, various issues associated with test and validation of high speed analog circuits, including innovative solutions for high parametric coverage and lower test cost. The scope of the workshop includes:
Representative topics include, but are not limited to:
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To present at the Workshop, authors are invited to submit paper proposals. The proposals may be summary (200 words) or full papers. Each submission should include: title, full name and affiliation of all authors, a short abstract of 50 words, and keywords. Also, identify a contact author and include a complete correspondence address, phone number, fax number, and e-mail address. Submit a copy of your paper proposal by Postscript, or PDF, via E-mail. Proposals for panel discussions are also invited. Paper and Panel submissions are due no later than October 8, 2010. Submit your paper proposal to:
Authors will be notified of the disposition of their papers by October 10, 2010. |
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Submission deadline: October 8, 2010 |
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Additional Information | |
General Information
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Committees | |
General Chairs Vice General Chair Program Chair Publicity Finance Publication Program Committee |
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For
more information, visit us on the web at: http://entity.eng.yale.edu/trela/tvhsac10/ |
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The 2nd IEEE International Workshop on Test and Validation of High Speed Analog Circuits (TVHSAC 2010 ) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC). |
IEEE
Computer Society- Test Technology Technical Council |
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