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TTTC's
Electronic Broadcasting Service |
First IEEE International Workshop on Testing |
CALL
FOR PAPERS |
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Submission Instructions – Submissions must be sent in as PDF file. The Workshop prefers Full Paper submissions (of up to six pages), but also allows Extended Abstract submissions (of at least two pages). Detailed submission instructions can be found at the Workshop’s website: http://3dtest.tttc-events.org. All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, technical soundness, and presented results. Selected submissions can be accepted for regular or poster presentation at the Workshop. Publications – The workshop will make available to all participants an Electronic Workshop Digest, which includes all material that authors are willing to provide: abstract, paper, slides, poster, etc. Authors of a selected subset of papers will be invited to submit extended journal versions of their manuscripts to be considered for a Special Issue of Springer’s ‘Journal of Electronic Testing – Theory and Applications’ (JETTA) being planned for 2011. |
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Submission deadline: August 23, 2010 |
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Additional Information | ||||
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Committees | ||||
General Chair: Program Chair: Finance Chair: Publication Chair: Publicity Chair: Web Chair: Program Committee Members: |
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For
more information, visit us on the web at: http://3dtest.tttc-events.org |
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The 1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D-Test10) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC). |
IEEE
Computer Society- Test Technology Technical Council |
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