TTTC’s interests encompass a wide variety of technologies, since each area in electronic test depends on its own specialized instrumentation and techniques.

A number of technologies are usually needed to test a single product thereby increasing the challenge. TTTC’s current scope includes, but is not limited to:

  • Testing of analog, digital, memory, FPGA, SiP, and RF Semiconductor circuits
  • Testing of embedded cores, integrated circuits, MCMs, boards and systems
  • Testability methods: built-in self-test, scan, and test synthesis
  • Verification and Validation
  • Embedded Test, ATE, Test resource partitioning
  • Yield Optimization, defect/fault tolerance and embedded repair methodologies
  • Infrastructure IP
  • On-line, IDDQ, thermal testing
  • Transient faults, soft errors, robustness, field reliability
  • Debug and Diagnosis



Conferences and symposia

19th IEEE Workshop on Silicon Errors in Logic – System Effects (SELSE) 2023

Paper registration: December 23, 2022
Paper submission: January 9, 2023

IEEE European Test Symposium 2023
Title+Abstract: December 9, 2022
Paper: December 16, 2022

IEEE VLSI Test Symposium 2023
Title+Abstract: November 5, 2022
Paper: November 11, 2022

DATE 2023
Title+abstract: September 18, 2022 (AoE)
Paper: September 25, 2022 (AoE)

IEEE Asian Test Symposium 2022
Abstract & Full Paper Submission Deadline: July 1st, 2022 (AoE)

ITC India 2022
Abstract & Full Paper Submission Deadline: May 9th, 2022

IOLTS 2022
Paper submission: May 10, 2022

LATS 2022
Title+abstract: May 6, 2022
Paper: May 13, 2022