TTTC’s interests encompass a wide variety of technologies, since each area in electronic test depends on its own specialized instrumentation and techniques.

A number of technologies are usually needed to test a single product thereby increasing the challenge. TTTC’s current scope includes, but is not limited to:

  • Testing of analog, digital, memory, FPGA, SiP, and RF Semiconductor circuits
  • Testing of embedded cores, integrated circuits, MCMs, boards and systems
  • Testability methods: built-in self-test, scan, and test synthesis
  • Verification and Validation
  • Embedded Test, ATE, Test resource partitioning
  • Yield Optimization, defect/fault tolerance and embedded repair methodologies
  • Infrastructure IP
  • On-line, IDDQ, thermal testing
  • Transient faults, soft errors, robustness, field reliability
  • Debug and Diagnosis



Upcoming conferences and symposia

IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS) 2024

Submission of title, abstract, and author list: 23 February, 2024
Final Paper Submission: 29 February, 2024
Author Notification: 09 April, 2024
Conference Dates: July 3 – 5, 2024

IEEE European Test Symposium (ETS) 2024
Paper registration: December 8, 2023
Paper PDF upload: December 16, 2023
Notification: February 16, 2024
Conference: May 20-24, 2024

IEEE VLSI Test Symposium (VTS) 2024
Paper registration: October 9, 2023
Paper PDF upload: October 15, 2023
Questions to authors: December 9, 2023
Submission of rebuttal: December 14, 2023
Notification: December 23, 2023
Camera-ready upload: February 03, 2024
Conference: April 22-24, 2024