TTTC's Electronic Broadcasting Service
TTTC Header Image
TTTC's Electronic Broadcasting Service

The IEEE 5th International Test Conference in Asia, 2021
August 18-20, 2021
Virtual (Co-organized with China Fault Tolerant Computing Conference, Shanghai, China)



With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, global proliferation and collaboration are becoming more and more important. International Test Conference has been the flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated in Taipei in 2017. This year, the 5th ITC-Asia will be held virtually in Shanghai China and co-located with China Fault Tolerant Computing Conference. Attendees to ITC-Asia can learn cutting edge research topics and industry practice in test technology. They will also be able to access the industry, hot topic forums, and exhibition organized by China Fault Tolerant Computing Conference.

The 10-page extended version of the 3 top ITC-Asia’21 papers will be published in ITC'21.

A BEST PAPER AWARD will be given to the most outstanding paper of ITC-Asia’21.

The topics of interest include (but are not limited to) the following ones:

  • Hardware Oriented Security and Thrust
  • Design Validation and Debug
  • ATE Design
  • Analog and Mixed-Signal Test
  • RF Test
  • High-Speed I/O Test
  • Fault Modeling and Simulation
  • ATPG ( Automatic Test Pattern Generation )
  • Design for Testability
  • Built-In Self-Test
  • Delay Test
  • System-on-Chip Test
  • Test Compression
  • Power-Aware and/or Thermal-Aware Test
  • Memory Test, Diagnosis, and Repair
  • Fault Diagnosis and Failure Analysis
  • Yield Analysis and Learning
  • Safety and Test for Automotive ICs
  • Test for Internet of Things
  • Test for Emerging Devices
  • CPU/GPU Test
  • MEMS/Sensor Test
  • Online Test
  • On-Chip Measurement
  • SiP, 2.5D, and 3D IC Test
  • Interconnect Test
  • Board-Level Testing and Diagnosis
  • Test Standards
  • Test Economics
  • Reliability Issues
  • Fault Tolerance
  • Test for Reconfigurable Systems
  • Software Test and Reliability
  • Dependable Systems and Networks


Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceedings, which will eventually be published in IEEE Xplore Digital Library. At least one full registration to the conference is required for each accepted paper.

Submission Website:


Key Dates

  • Submission of full paper:     May 17, 2021
  • Notification of acceptance:    June 18, 2021
  • Camera-ready manuscript:    June 30, 2021
Additional Information

General Information:

Technical Program Co-Chair: Ying Zhang 

Tel: +86 21-69589585



For more information, visit us on the web at:

ITC-Asia’21  is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).

IEEE Computer Society-Test Technology Technical Council

This message contains public information only. You are invited to copy and distribute it further.

For more information contact the TTTC office or visit

To remove or modify your contact information, or to register new users, please click here and follow the on-line instructions.