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The 4th IEEE International Test Conference in Asia
(ITC-Asia 2020)
Sep. 23-25, 2020
Taipei, Taiwan

http://sscas.ee.ncku.edu.tw/ITC-Asia-2020/

SUBMISSION DEADLINE of TITLE and ABSTRACT: March 2, 2020
CALL FOR PAPERS

Scope

With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated and co-located with SEMICON Taiwan in Taipei. Attendee can involve themselves in not only the state-of-the-art test technology trend, but also numerous semiconductor industry forums organized by SEMICON Taiwan.

The topics of interest include (but are not limited to) the following ones:

  • Analog and Mixed-Signal Test
  • ATE Design
  • ATPG (Automatic Test Pattern Generation)
  • Automotive IC Test
  • Board-Level Testing and Diagnosis
  • Built-In Self-Test for Logic Circuits
  • CPU/GPU Test
  • Delay Test
  • Design for Testability for Logic Circuits
  • Design Validation and Debug
  • Fault Diagnosis and Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • Hardware Oriented Security and Thrust
  • High-Speed I/O Test
  • Interconnect Test
  • Memory Test, Diagnosis, and Repair
  • MEMS Test
  • On-Chip Measurement
  • Online TestPower-Aware and/or Thermal-Aware Test
  • Reconfigurable System Test
  • Reliability Issues
  • RF Test
  • Sensor Test
  • SiP, 2.5D, and 3D IC Test
  • System-on-Chip Test
  • Test Compression
  • Test Economics
  • Test Methods for Low-Power Circuits
  • Test Methods for Emerging Devices
  • Test Methods for Internet of Things
  • Test Standards
  • Yield Analysis and Learning

Submissions

Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceedings, which will eventually be published in IEEE Xplore Digital Library. At least one full registration to the conference is required for each accepted paper.

Key Dates

  • Submission of title and abstract: Mar. 2, 2020
  • Paper submission: Mar. 9, 2020
  • Notification of acceptance: May 11, 2020
  • Camera-ready manuscript: June 22, 2020
Additional Information

Submission Information

Soon-Jyh Chang

National Cheng Kung University

Tel: +886-6-2757575 Ext. 62380

soon@mail.ncku.edu.tw

 

General information

Wen Lu

SEMI Taiwan

Tel: +886-3-560-1777 Ext. 105

wlu@semi.org

 

or more information, visit us on the web at: http://sscas.ee.ncku.edu.tw/ITC-Asia-2020/

Committee

Steering Committee Members

Kuen-Jong Lee (Chair), National Cheng-Kung Univ.

Tomoo Inoue, Hiroshima City Univ.

Xiaowei Li, Chinese Academy of Sciences

Li-C. Wang, U. of California, Santa Barbara

Cheng-Wen Wu, National Tsing Hua Univ.

Yervant Zorian, Synopsys

 

General Chair, Shi-Yu Huang, National Tsing Hua Univ.

Technical Program Chair, Soon-Jyh Chang, National Cheng Kung Univ.

Finance Chair, Ming-Der Shieh, National Cheng Kung Univ.

Publications Chair, Jiun-Lang Huang, National Taiwan Univ.

Publicity Chair, Hsin-Wen Ting, National Kaohsiung Univ.of Science and Technology

Tutorials Chair, Hung-Pin (Charles) Wen, National Chiao Tung Univ.

Local Arrangements Chair, Wen Lu, SEMI Taiwan

Industry Sessions Chair, Harry Chen, MediaTek Inc.

Exhibitions Chair, Terry Tsao, SEMI Taiwan

US Liaison, Krishnendu Chakrabarty, Duke University

Europe Liaison, Ilian Polian, Stuttgart University

ITC Liaison, Jennifer Dworak, Consultant

For more information, visit us on the web at: http://sscas.ee.ncku.edu.tw/ITC-Asia-2020/

The The 4th IEEE International Test Conference in Asia is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).



IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


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