TTTC's Electronic Broadcasting Service
IEEE Test Technology Educational
ITC 2017 - CALL FOR TUTORIALS PARTICIPATION
The Test Technology Educational Program (TTEP’17) of the TTTC is
offering 12 half-day tutorials during the weekend before the ITC
test week. This year, the TTEP tutorials will touch the most
important topics of the test scenario, problems and solutions
taught by recognized experts of the field.
Register for Test Week Tutorials at the ITC Registration Page
October 29, 2017
INTERCONNECTED IEEE STANDARDS
by Teresa McLaurin, Adam Cron, Artur Jutman
There has been a continuous development trend of IEEE Test Standards addressing access to DFT resources inside evolving packaged electronics. This tutorial will address the most popular test access standards and the most salient aspects of each. These include IEEE Stds 1149.1 (package/board connection and beyond) , 1687 (instrument access through 1149.1), 1500 (core wrapping), and P1838 (3DIC test access). These standards can interact with each other and may rely on other IEEE standards to support automated construction, and design and use methodologies which will be addressed by the authors.
PRACTICES IN HIGH SPEED I/O TESTING
by Salem Abdennadher, Saghir Shaik
With advances in VLSI technology, packaging and architecture, Systems on Chip (SoC) continue to increase in complexity. Increasing complexity has resulted in an unprecedented increase in design errors, manufacturing flaws and customer returns related to High-Speed I/O (HSIO) circuits. This tutorial presents challenges and existing techniques to meet test complexity of HSIO and methodologies needed to achieve the high-quality usually mandated by the critical applications such as automotive. Both system and block level test techniques with particular emphasis on DFT/BIST based methods and their suitability to production level environment are presented in this tutorial. Additionally, this tutorial includes a section on test practices for 2.5D/3D products with IO interfaces.
LEARNING TECHNIQUES FOR RELIABILITY MONITORING, MITIGATION
by Mehdi Tahoori
With increasing the complexity of digital systems and the use of advanced nanoscale technology nodes, various process and runtime variabilities threaten the correct operation of these systems. The interdependence of these reliability detractors and their dependencies to circuit structure as well as running workloads makes it very hard to derive simple deterministic models to analyze and target them. As a result, machine learning techniques can be used to extract useful information which can be used to effectively monitor and improve the reliability of digital systems. The purpose of this tutorial is to discuss and evaluate various learning schemes in order to analyze the reliability of the system due to various runtime failure mechanisms which originate from process and runtime variabilities such as thermal and voltage fluctuations, device and interconnect aging mechanisms, as well as radiation‐induced soft errors.
TARGETING "ZERO DEFECT" IC QUALITY: ADVANCED CELL AWARE FAULT MODELS AND ADAPTIVE TEST
by Adit Singh
Commercial applications continue to demand ever-higher IC quality. Meanwhile, recent experience with new fault models suggests that current structural test methodologies can miss significant defectivity, resulting in increasing reliance on expensive system level tests as a final defect screen. This two-part tutorial presents a comprehensive study of known state-of-the-art techniques directed at targeting “Zero-Defect” IC quality. Part one focuses on new fault models, including the cell aware methodology, for an in-depth understanding of the actual defects in modern standard cells that are missed by conventional stuck-at and TDF tests but detected by the new fault models. Part two presents adaptive test methods that employ innovative statistical techniques to further improve test effectiveness by optimizing the tests applied to individual parts.
MIXED-SIGNAL DFT & BIST: TRENDS, PRINCIPLES, AND SOLUTIONS
by Stephen Sunter
The lack of automated analog DFT means that analog circuitry accounts for almost all failures in automotive mixed-signal ICs. This tutorial strives to improve this situation. We review trends in ad hoc DFT and fault simulation, IEEE DFT standards 1149.1, .4, .6, .7, .8, .10, and 1687, as well as ISO 26262, and then review BIST techniques for ADC/DAC, PLL, SerDes/DDR, and random analog. Seven essential principles of practical analog BIST are presented, concluding with specification-based structural test. Lastly, we discuss practical DFT techniques, ranging from quicker analog defect coverage/tolerance simulation, and DFT simplification, to oversampling and undersampling methods that greatly improve range, resolution, and reusability, leading to an automatable mixed-signal DFT strategy being developed for a future IEEE standard.
MACHINE LEARNING FOR TEST AND TEST FOR MACHINE LEARNING
by Li-C. Wang
Applying "machine learning" for test has been a growing field of interest in recent years. Many applications have been successfully demonstrated. In this tutorial, I will review the basic principles of applying so-called "machine learning" in selected test applications and highlights the key challenges. Results based on actual industrial settings will be shown to explain the benefits and the barriers for developing a practical learning framework. More importantly, I will explain the fundamental difference between the "machine learning” for test and the popular machine learning employed in image/speech recognition and autonomous driving. In addition, the tutorial will review the growing trends on developing machine learning based systems such as autonomous vehicles and the challenges of test for those systems.
October 30, 2017 (Monday)
AUTOMOTIVE RELIABILITY & TEST STRATEGIES
by Riccardo Mariani, Yervant Zorian
Given today’s fast growing automotive semiconductor industry, this tutorial will discuss the implications of automotive test, reliability and functional safety requirements on all aspects of the SOC lifecycle. This will include design, silicon bring-up, volume production, and particularly in-system test stages. Today’s automotive safety critical chips need multiple in-system self-test modes, such as power-on self-test and repair, periodic in-field self-test, advanced error correction solutions, etc. This tutorial will analyze these specific in-system test modes and the discuss the benefits of selecting ISO 26262 certified solutions, in order to ensure that standardized functional safety requirements are met, while accelerating time to market for automotive SOCs.
TESTING OF TSV-BASED 2.5D- AND 3D-STACKED ICS
by Krishnendu Chakrabarty
Stacked ICs with vertical interconnect containing fine-pitch micro-bumps and through-silicon vias (TSVs) are a hot-topic in design and manufacturing communities. These 2.5D- and 3D-SICs hold the promise of heterogeneous integration, inter-die connections with increased performance at lower power dissipation, increased yield and decreased product cost. This tutorial presents key concepts in 3D technology, terminology, and benefits. We discuss design, test challenges and emerging solutions for 2.5D- and 3D-SICs. Covered topics include overview of 3D integration and trend-setting products such as 2.5D-FPGA, 3D-stacked memory chips, test flows and test content for 3D chips, advanced wafer probing, 3D design-for-test architectures and ongoing IEEE P1838 standardization, and 3D test cost modeling and test-flow selection.
FROM DATA TO ACTIONS: APPLICATIONS OF DATA ANALYTICS IN SEMICONDUCTOR MANUFACTURING & TEST
by Yiorgos Makris, Haralampos Stratigopoulos
This tutorial seeks to elucidate the utility of data analytics in semiconductor manufacturing and test. Relevant concepts from data analytics theory will be introduced and agglomerated with current practice, showcasing their effectiveness on actual case studies with industrial data. A comprehensive survey of the relevant literature will be provided, organized around four themes: (i) Replacement of standard tests by low-cost alternatives and/or elimination of superfluous tests based on machine learning techniques; (ii) Adaptive test aiming at adjusting in real-time on a wafer-by-wafer or die-to-die basis the test content, limits, and order; (iii) Test cost reduction by exploiting wafer-level spatial and lot-level spatiotemporal correlations; (iv) Process monitoring for yield loss attribution, yield estimation, outlier detection, and yield forecasting in production migration and fab attestation.
MEMORY TEST & REPAIR IN FINFET ERA
by Yervant Zorian
Recent growth in content delivery has led to an explosion in the use of embedded memories. This tutorial will present the trends and challenges of growing memory content on chip and how to ensure detection of today’s defects upon manufacturing and during life time, including process variation and FinFET specific defects including 7nm technology. BIST and Repair solutions to address debug, diagnosis, yield optimization and data retention of failure modes will be presented. Given the tens of thousands of embedded memory instances in today’s SOCs, this tutorial will also cover power management constraints, functional timing implications, test scheduling optimization, and area minimization options.
TEST, DIAGNOSIS, AND ROOT-CAUSE IDENTIFICATION OF FAILURES FOR BOARDS AND SYSTEMS
by Bill Eklow, Krishnendu Chakrabarty
The gap between working silicon and a working board/system is becoming more significant and problematic as technology scales and complexity grows. The result of this increasing gap is failures at the board and system level that cannot be duplicated at the component level. These failures are most often referred to as “NTFs” (No Trouble Founds). The result of these NTFs can range from higher manufacturing costs and inventories to failure to get the product out of the door. This tutorial provides a detailed background on the nature of this problem and will provide DFT, test, and root-cause identification solutions at board/system level.
FROM TEST TO POST-SILICON VALIDATION: CONCEPTS AND RECENT TRENDS
by Arani Sinha, Sandip Ray
The tutorial provides a broad overview of post-silicon bring-up, debug, and diagnosis, and discusses fundamental concepts and current practices in this area. It introduces the spectrum of validation activities, e.g., functionality, software compatibility, electrical characteristics, speed path, etc. Activities involved in validation planning along the system life cycle are covered, and various conflicts and trade-offs are discussed. The trade-offs span a spectrum of topics, including security, power management, and physical design. The tutorial will describe approaches to repurpose Design-for-Test (DfT) infrastructure for post-silicon validation, and the collaboration areas between validation and test. Instrumentation, control, and observability technologies including tracing and triggering, scan dumping, and off-chip transport will be addressed. The focus of the tutorial is on industrial adoption and practice.
INDUSTRIAL RELATIONS CHAIR
ELECTRONIC MEDIA CHAIRS
For more information, visit us on the web at: http://ttep.tttc-events.or
The Test Technology Educational Program 2017 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC)
IEEE Computer Society- Test Technology Technical Council
Alcatel-Lucent – USA