TTTC's Electronic Broadcasting Service

CALL FOR PAPERS

Scope

From auspicious beginnings over ten years ago, the promise of 3D-IC has begun to turn the corner to more popular usage. This Special Issue on multi-chip packages focuses exclusively on design and design-for-test for three-dimensional, chiplet-based, and stacked ICs, based on through-silicon vias (TSVs), micro-bumps, and/or interposers. While these stacked ICs offer many attractive advantages with respect to heterogeneous integration, small form-factor, high bandwidth and performance, and low power dissipation, there are many open issues with respect to designing and testing such products. This issue provides a platform to present and discuss these challenges and solutions among researchers and practitioners alike.

This special issue seeks original manuscripts that will cover innovative research and practical applications for the testability and design challenges on both pure 3DIC implementations, as well as other multi-chip packaging implementations, including chiplets, active and passive interposers. The specific topics of interest include but are not limited to:

Defect Detection Techniques
DfT Architectures for 3D-ICs
EDA Design-for-Test Flows
Failure Analysis for 3D-ICs
Fault-Tolerant Design for 3D-ICs
Interposer Testing
Known-Good Die/Stack Testing
Standard Interfaces between Chiplets
Methods for Power/Heat Dissipation during Test
Pre-, Mid-, and Post-Bond Testing of 3D-ICs
Reliability of 3D-ICs
Improving Yield of 3D-ICs
Redundancy & Repair
Standards for 3D Testing, incl. IEEE Std 1838
System/Board Test Issues for 3D-ICs
Tester Architecture incl. ATE and BIST

Submission Guidelines

Prospective authors should follow the submission guidelines for IEEE Design & Test. All manuscripts must be submitted electronically to IEEE Manuscript Central at https://mc.manuscriptcentral.com/dandt. Indicate that you are submitting your article to the special issue on Design and Test of Multi-Chip Packages. Manuscripts must not exceed 5,000 words, including figures (with each average-size figure counting as 200 words) and a maximum of 12 references (30 for surveys). This amounts to about 4,000 words of text and a maximum of five small to medium figures. Accepted articles will be edited for clarity, structure, conciseness, grammar, passive to active voice, logical organization, readability, and adherence to style. Please see IEEE Design & Test Author Information at:

https://ieee-ceda.org/publication/ieee-design-test-dt/author-info.

Schedule
Submission Deadline : October 15, 2021
Notification First Round : December 15, 2021
Revision Submission : January 31, 2022
Final Notification : February 28, 2022
Final Version Due : April 1, 2022

Additional Information

Please direct any questions regarding this special issue to one of the following:

Adam Cron, Distinguished Architect, Synopsys Inc., USA, a.cron@ieee.org
Hailong Jiao, Associate Professor at the Shenzhen Graduate School of Peking University, China, jiaohailong@pku.edu.cn
Erik Jan Marinissen, Scientific Director, imec, Belgium, erik.jan.marinissen@imec.be
and Visiting Researcher at Eindhoven University of Technology, the Netherlands

This special issue is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).

This message contains public information only. You are invited to copy and distribute it further.

For more information contact the TTTC office or visit http://tab.computer.org/tttc/

To remove or modify your contact information, or to register new users, please click here and follow the on-line instructions.