TTTC's Electronic Broadcasting Service
TTTC Header Image
TTTC's Electronic Broadcasting Service

European Workshop on Silicon Lifecycle Management
(eSLM)
Friday, 18 March 2022
Virtual Event

https://people.rennes.inria.fr/Marcello.Traiola/eSLM22/

SUBMISSION DEADLINE January 15, 2022
CALL FOR SUBMISSIONS

Scope

With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and secure operation of electronics in safety-critical, enterprise servers and cloud computing domains is still a major challenge. While traditionally design time and test time solutions were supposed to guarantee the in-field dependability and security of electronic systems, due to complex interaction of runtime effects from running workload and environment, there is a great need for a holistic approach for silicon lifecycle management, spanning from design time to in-field monitoring and adaptation. Therefore the solutions for lifecycle management should include various sensors and monitors embedded in different levels of the design stack, access mechanisms and standards for such on-chip and in-system sensor network, as well as data analytics on the edge and in the cloud. This European edition of the eSLM Workshop tries to build a community around this topic and offer a forum to present and discuss these challenges and emerging solutions among researchers and practitioners alike.

eSLM will take place in conjunction with the DATE 2022 Conference.

Topic Areas – You are invited to participate and submit your contributions to the eSLM Workshop. The workshop’s areas of interest include (but are not limited to) the following topics:

  • Design and placement of various sensors and monitors for functional safety and security
  • Standards for sensor data aggregation
  • Data analytics for sensor data processing
  • Anomaly detection for security and functional safety
  • Machine learning for in-field system health monitoring
  • Multi-layer dependability evaluation
  • In-field verification and validation
  • Fault tolerance and self-checking circuits
  • Aging effects on electronics
  • Reuse and extension of test, debug and repair infrastructure for in-filed management
  • Power-up, power-down and periodic tests
  • System level test
  • Preventive Maintenance
  • Concurrent and periodic checking
  • Functional and structural test generation
  • Graceful degradation
  • Useful remaining lifetime prediction
  • Failure prediction and forecasting
  • Attack prediction and prevention
  • In-field configuration and adaptation
  • Cross-layer solutions

Submissions

Submission Instructions – The Workshop asks for the submission of Extended Abstracts of maximum two pages; camera ready version can be extended up to 4 pages. All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, technical soundness, and presented results. Selected submissions can be accepted for regular or short presentation at the Workshop.

Submission website: https://www.softconf.com/date22/eSLM/

Key Dates

 Submission deadline : January 15, 2022

 Notification of acceptance : February 15, 2022

 Camera-ready material : March 1, 2022


Committee

Organizer: Mehdi Tahoori, Karlsruhe Institute of Technology, Germany

General Chair: Yervant Zorian - Synopsys (US)

Program Chair: Mehdi Tahoori – KIT (DE)

Web Chair: Marcello Traiola – Inria/IRISA lab (FR)

For more information, visit us on the web at: https://people.rennes.inria.fr/Marcello.Traiola/eSLM22/

eSLM is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).



IEEE Computer Society-Test Technology Technical Council



This message contains public information only. You are invited to copy and distribute it further.

For more information contact the TTTC office or visit http://tab.computer.org/tttc/

To remove or modify your contact information, or to register new users, please click here and follow the on-line instructions.