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TTTC's Electronic Broadcasting Service

The 30th IEEE Asian Test Symposium
(ATS 2021)
November 22 - 25, 2021
Virtual Event Hosted by Japan

https://www.ats2021.info.hiroshima-cu.ac.jp/

Submission Deadline Extended Further!: June 19, 2021
CALL FOR PAPERS

Scope

The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system, board, and device testing with design, manufacturing, and field consideration in mind. 

Topics of interest include (but are not limited to): 

  • Analog/Mixed-Signal Test 
  • Automatic Test Generation 
  • Board Test and Diagnosis 
  • Boundary Scan Test 
  • Built-In Self-Test (BIST) 
  • Connectivity Testing 
  • Defect-Based Test 
  • Delay and Performance Test 
  • Dependability and Functional Safety 
  • Design for Test (DFT) 
  • Diagnosis and Silicon Debug 
  • Economic of Test 
  • Failure Analysis 
  • Fault Modeling and Simulation 
  • Fault Tolerance 
  • GPU Test 
  • Hardware-Oriented Security and trust 
  • High-Speed I/O Test 
  • Low-Power IC Test 
  • Machine Learning in Test 
  • Memory Test and Repair 
  • Multi-/Many-core Processor Test 
  • Online Test 
  • Power/Thermal/Reliability Issues in Test 
  • Reconfigurable System Test 
  • RF Test 
  • Self-Repair 
  • SiP, Stacked, 3D IC Test 
  • Standards in Test 
  • Test Compression 
  • Test for Biomedical Circuits and Systems 
  • Test for MEMS and Microfluidic Systems 
  • Test for Nanoscale Devices and Emerging Technologies 
  • Test for Reversible and Quantum Circuits 
  • Test for Sensors and IoT 
  • Test Quality 
  • Test Synthesis 
  • Validation and Verification 
  • Yield Analysis and Enhancement

Submissions

All submission should be made electronically in PDF format at (https://easychair.org/conferences/?conf=ats2021). A submission should contain a complete manuscript within a limit of 6 pages in 10-point single-spaced double-column format, and an abstract of 50–200 words. The paper must be submitted for a single-blind review process. Once a submission is accepted, the author(s) must prepare the final camera-ready manuscript in time for inclusion in the proceedings, and present the paper at the symposium. In case of any difficulty in submission, authors may contact 
ats2021ogmember [at] aries30.cse.kyutech.ac.jp.

Key Dates

Submission deadline (PDF paper): June 19, 2021 (Extended Further!)June 2, 2021 (Extended) May 23, 2021
Notification of acceptance: August 6, 2021 July 29, 2021
Camera-ready manuscript: September 7, 2021 August 31, 2021
Additional Information
Committee

General Co-Chair

Yukiya Miura (Tokyo Metropolitan University, Japan)
Satoshi Ohtake (Oita University, Japan)

General-Vice Chair

Hideyuki Ichihara (Hiroshima City University, Japan)

Program Chair

Yoshinobu Higami (Ehime University, Japan)

Program-Vice Chair

Hiroyuki Yotsuyanagi (Tokushima University, Japan)

Finance Chair

Masayuki Arai (Nihon University, Japan)

Local Arrangement Chair

Senling Wang (Ehime University, Japan)

Registration Chair

Satoshi Komatsu (Tokyo Denki University, Japan)

Registration-Vice Chair

Hiroshi Yokoyama (Akita University, Japan)

Publicity Chair

Tsuyoshi Iwagaki (Hiroshima City University, Japan)

Publication Chair

Stefan Holst (Kyushu Institute of Technology, Japan)

Industry Chair

Masahiro Ishida (Advantest Corp., Japan)

Tutorial Chair

Michihiro Shintani (Nara Institute of Science and Technology, Japan)

Secretary

Kohei Miyase (Kyushu Institute of Technology, Japan)

North American Liaison

Krishnendu Chakrabarty (Duke University)

European Liaison

Erik Larsson (Lund University)
For more information, visit us on the web at: https://www.ats2021.info.hiroshima-cu.ac.jp/

ATS21 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).
IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI
Politecnico di Torino - Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR
Synopsys, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

  

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

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