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18th IEEE European Test Symposium
(ETS 2013)

May 27-31, 2013
Conference Center of the Popes’ Palace, Avignon, France

http://www.ieee-ets.org

CALL FOR PARTICIPATION

Scope -- Key Dates -- Venue -- Workshop Registration -- Advance Program -- More Information -- Committees

Scope

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The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, practical applications, hot topics and new trends in the area of electronic-based circuits and system testing. In 2013, ETS will take place in the Conference Center of the Popes’ Palace in the beautiful and historic city of Avignon, France, and is organized by LIRMM and co-sponsored by the University of Montpellier 2, the CNRS and the Test Technology Technical Council (TTTC) of the IEEE Computer Society.

The ETS’13 technical program includes 9 scientific paper sessions, 2 workshop-type paper sessions, 5 special sessions, 3 vendor presentation sessions, 3 embedded tutorials, 2 panels, 1 PhD student work-in-progress paper session and 3 poster sessions. It also includes the following 2 keynote speeches:

  • Magical Thinking Applied to Test Engineering Reality (and vice versa) by Jeff Rearick (AMD, USA)
  • Outlook for Many-Core Systems: Cloudy with a Chance of Virtualization by Nikil Dutt (University of California Irvine, USA)

An exciting social program will allow attendees to enjoy the beautiful and historic city of Avignon and its surroundings. More details can be found at: http://www.lirmm.fr/ETS13/.

The European Test Symposium proposes a three-day Test Spring School (TSS@ETS 2013) for Ph.D. and M.Sc. students. Renowned experts will give lectures to cover the main challenges of validation and diagnosis of today's electronic systems. You can have a look at the school program at: http://www.iti.uni-stuttgart.de/tss2013/. TSS@ETS 2013 will take place in Sète, France, May 24-27, 2013. Please register as soon as possible through the website at http://www.lirmm.fr/ETS13/tss.php.

The following “Monday Embedded Tutorials” on emerging test technology topics will be offered on Monday, May 27, in the Conference Center of the Popes’ Palace, from 14h00 to 18h30:

  • Effective post-silicon validation by S. Mitra (Stanford University, USA)
  • Design, Test and Debug of Printed Circuit Assemblies by B. Eklow and B. Achkir (Cisco Systems, USA)

Three ETS’13 fringe workshops will also be organized, May 30-31, 2013:

  • Manufacturable and Dependable Multicore Architectures at Nanoscale (MEDIAN)
  • Design and Test Methodologies for Emerging Technologies (DETMET)
  • Trustworthy Manufacturing and Utilization of Secure Devices (TRUDEVICE)
Key Dates
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Early registration deadline to ETS’13:  April 26, 2013
Hotel reservation deadline:  April 26, 2013 (first come first serve)
The Venue
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Information is available at: http://www.lirmm.fr/ETS13/local.php
Workshop Registration
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Registration is available at: http://www.lirmm.fr/ETS13/registration.php

Advance Program
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Tuesday -- Wednesday -- Thursday

May 28, 2013 (Tuesday)
 
8:00 - 10:30 PLENARY SESSION
8:30 - 9:00

OPENING

Welcome Address
Patrick Girard (LIRMM, FR), ETS’13 General Chair

Program Introduction
Zebo Peng (Linköping University, SE), ETS’13 Program Chair

ETS’12 Best Paper Award
Massimo Violante (Politecnico di Torino, IT), ETS’12 Program Chair

Symposium Information
Arnaud Virazel (LIRMM, FR), ETS’13 Organization Chair

9:00 - 9:45

Keynote 1: Magical Thinking Applied to Test Engineering Reality (and vice versa)
Jeff Rearick (AMD, US)

9:45 - 10:30
Keynote 2: Outlook for Many-Core Systems: Cloudy with a Chance of Virtualization
Nikil Dutt (University of California Irvine, US)
 
10:30 - 11:00 COFFEE BREAK
 
11:00 - 12:30 SESSIONS 2A, 2B, 2C
 

Session 2A - TESTING OF CORE-BASED SOCS AND 3D STACKED ICS
Moderators: tbd

2A.1 - Robust Optimization of Test-Architecture Designs for Core-Based SoCs
Sergej Deutsch, Krishnendu Chakrabarty (Duke University, US)

2A.2 - Computing Detection Probability of Delay Defects in Signal Line TSVs
Carolina Metzler, Aida Todri-Sanial, Alberto Bosio, Luigi Dilillo, Patrick Girard, Arnaud Virazel (LIRMM, FR); Pascal Vivet, Marc Belleville (CEA-LETI, FR)

2A.3 - Automated DfT Insertion and Test Generation for 3D-SICs with Embedded Cores and Multiple Towers
Christos Papameletis, Brion Keller, Vivek Chickermane (Cadence Design Systems, NL); Erik Jan Marinissen (IMEC, BE); Said Hamdioui (Delft University of Technology, NL
)

 

SESSION 2B - SOFTWARE-BASED TEST AND SYSTEM DEPENDABILITY
Moderators: tbd

2B.1 - Efficient Fault Simulation Through Dynamic Binary Translation for Dependability Analysis of Embedded Software
Graziano Pravadelli, Franco Fummi (University of Verona, IT); Giuseppe Di Guglielmo (Columbia University in the City of New York, US); Davide Ferraretto (University of Verona, IT)

2B.2 - Experimental Evaluation of Thread Distribution Effects on Multiple Output Errors in GPUs
Paolo Rech, Caroline Aguiar (UFRGS, BR); Christopher Frost (STFC, UK); Luigi Carro (UFRGS, BR)

2B.3 - A Software-Based Self Test of CUDA Fermi GPUs
Daniele Rolfo, Stefano Di Carlo, Giulio Gambardella, Marco Indaco, Ippazio Martella, Paolo Prinetto, Pascal Trotta (Politecnico di Torino, IT)

 

SESSION 2C - SPECIAL INDUSTRIAL SESSION - DESIGNING AND MANUFACTURING ZERO-DEFECT-PER-MILLION ICS IN FORTHCOMING TECHNOLOGIES
Moderators: tbd

2C.1 - Diagnostic for Yield and Reliability Learning: Industrial Experiences
Davide Appello (STMicroelectronics, IT)

2C.2 - Process Technology, Test and Zero Defects
Bram Kruseman (NXP, NL)

2C.3 - Zero Defect � More than Fault Coverage and Fault Models
Hermann Obermeir (Infineon, DE)

 
12:30 - 14:15 LUNCH
 
14:15 - 15:45 SESSIONS 3A, 3B, 3C
 

SESSION 3A - SCAN-BASED TEST AND DIAGNOSIS
Moderators: tbd

3A.1 - Scan Pattern Retargeting and Merging with Reduced Access Time
Rafal Baranowski, Michael Kochte, Hans-Joachim Wunderlich (University of Stuttgart, DE)

3A.2 - Utilizing Circuit Structure for Scan Chain Diagnosis
Lo Wei-Hen, Hsieh Ang-Chih, Lan Chien-Ming, Lin Min-Hsien, Hwang Tingting (National Tsing Hua University, TW)

3A.3 - A Layout-aware X-Filling Approach for Dynamic Power Supply Noise Reduction in At-Speed Scan Testing
Saman Kiamehr, Farshad Firouzi, Mehdi Tahoori (Karlsruhe Institute of Technology, DE)

 

SESSION 3B - WORKSHOP-TYPE PAPERS - LOW-POWER SCAN, JTAG AND DEFECT SIMULATION
Moderators: tbd

3B.1 - Peak Scan Capture Power Reduction Using a Novel On-Chip Clock Sequencer
Swapnil Bahl, Shray Khullar (STMicroelectronics, IN)

3B.2 - A New Execution Model for Interactive JTAG Applications
Michele Portolan, Bradford Van Treuren, Suresh Goyal (Alcatel-Lucent, US)

3B.3 - A New Analog Defect Simulator Using Old Techniques
Stephen Sunter (Mentor Graphics, DE); Krzysztof Jurga, Bartosz Kaczmarek (Poznan University, PL)

 

SESSION 3C - VENDOR PRESENTATION SESSION - TEST AND RELIABILITY IMPROVEMENT
Moderators: tbd

3C.1 - T2000 IPS Effective Test Solution for Integrated Power Devices
Stuart Ainslie (Advantest Europe GmbH, DE)

3C.2 - Embedded Test and Repair for Advanced Geometry Designs
Yervant Zorian (Synopsys, US)

3C.3 - Ridgetop Innovations for Improved Testing, Better Reliability, and Foundry Process Qualification
Hans Manhaeve (Ridgetop Europe, BE)

 
15:45 - 16:45 POSTERS & COFFEE BREAK
 

POSTER SESSION P1 - FAULT TOLERANCE, DIAGNOSIS, AND RELIABILITY
Moderators: tbd

P1.1 - Fault Mitigation Strategies for CUDA GPUs
Daniele Rolfo, Stefano Di Carlo, Giulio Gambardella, Marco Indaco, Ippazio Martella, Paolo Prinetto, Pascal Trotta (Politecnico di Torino, IT)

P1.2 - Adaptive Self-Mapping Applications for Many-cores System on Chips
Fabien Chaix, Gilles Bizot, Michael Nicolaidis, Zergainoh Nacer-Eddine (TIMA, FR)

P1.3 - A Minimum MSE Sensor Fusion Algorithm with Tolerance to Multiple Faults
Omid Sarbishei, Atena Roshan Fekr, Majid Janidarmian, Benjamin Nahill, Katarzyna Radecka (McGill University, CA)

P1.4 - SRAM Decoder Reliability Analysis Under Bias Temperature Instability
Seyab Khan, Said HamdiouiI (Delft University of Technology, NL); Halil Kukner, Praveen Raghavan, Francky Catthoor (IMEC, BE)

P1.5 - Generation of Compact Multi-Cycle Diagnostic Test Sets
Irith Pomeranz (Purdue University, US)

P1.6 - Aggresive Scan Chain Masking for Improved Diagnosis of Multiple Scan Chain Failures
Subhadip Kundu, Santanu Chattopadhyay, Indranil Sen Gupta (Indian Institute of Technology Kharagpur, IN); Rohit Kapur (Synopsys, US)

P1.7 - PinPoint: An Algorithm for Enhancing Diagnostic Resolution Using Capture-Cycle Power Information
Seetal Potluri (Indian Institute of Technology Madras, IN); Satya Trinadh (Indian Institute of Technology Hyderabad, IN); Roopashree Baskaran (National Institute of Technology Trichy, IN), Kamakoti Veezhinathan, Nitin Chandrachoodan (Indian Institute of Technology Madras, IN)

 
16:45 - 18:15 SESSIONS 4A, 4B, 4C
 

SESSION 4A - ANALOG AND RF TEST 1
Moderators: tbd

4A.1 - Adaptive Performance Binning for Analog Circuits Ender
Yilmaz, Sule Ozev (Arizona State University, US); Kenneth Butler (Texas Instruments, US)

4A.2 - On Combining Alternate Test with Spatial Correlation Modeling in Analog/RF ICs
Ke Huang (University of Texas at Dallas, US); Nathan Kupp (Yale University, US); John Carulli (Texas Instruments, US); Yiorgos Makris (University of Texas at Dallas, US)

4A.3 - M-S Test Based on Specification Validation Using Octrees in the Measure Space
Alvaro Gomez-Pau, Luz Balado, Joan Figueras (UPC, ES)

 

SESSION 4B � PANEL - WHAT IS THE SEMICONDUCTOR INDUSTRY DOING TO WIN THE BATTLE AGAINST THE EXPECTED SCARY FAILURE RATES IN FUTURE TECHNOLOGY NODES?
Organizer: Said Hamdioui (Delft University of Technology, NL)
Panelists: tbd

 

SESSION 4C - EU PROJECT INFORMATION 1
Moderators: tbd

4C.1 - A Scalable Approach for Automated Bug Localization
Maksim Jenihhin (Technical University of Tallin, EE)

4C.2 - AUTOMICS: Pragmatic Solution for Parasitic-Immune Design of Electronics ICs for Automotive
Ramy Iskander (LIP6, FR)

4C.3 - TRUDEVICE: Trustworthy Manufacturing and Utilization of Secure Devices
Giorgio Di Natale (LIRMM, FR)

 
18:30 - 19:30 WINE TESTING PARTY
 
May 29, 2013 (Wednesday)
 
8:30 - 10:00 SESSIONS 5A, 5B, 5C
 

SESSION 5A - ANALOG AND RF TEST 2
Moderators: tbd

5A.1 - Analytical Modeling for EVM in OFDM Transmitters Including the Effects of IIP3, I/Q Imbalance, Noise, AM/AM and AM/PM Distortion
Afsaneh Nassery, Sule Ozev (Arizona State University, US); Mustapha Slamani (IBM, US)

5A.2 - Efficient Selection of Signatures for Analog/RF Alternate Test
Manuel Barragan, Gildas Leger (IMSE-CNM, ES)

5A.3 - Efficient System-Level Testing and Adaptive Tuning of MIMO-OFDM Wireless Devices
Shyam Kumar Devarakond, Debashis Banerjee, Aritra Banerjee (Georgia Institute of Technology, US); Shreyas Sen (Intel, US); Abhijit Chatterjee (Georgia Institute of Technology, US)

 

SESSION 5B - WORKSHOP-TYPE PAPERS - SECURITY, SAFETY AND YIELD ANALYSIS
Moderators: tbd

5B.1 - #SAT for Vulnerability Analysis of Security Components
Linus Feiten, Matthias Sauer, Tobias Schubert, Alexander Czutro (University of Freiburg, DE); Victor Tomashevich (University of Passau, DE); Eberhard Boehl (Robert Bosch GmbH, DE); Ilia Polian (University of Passau, DE); Bernd Becker (University of Freiburg, DE)

5B.2 - Verification Tool Development in Accordance with ISO 26262
Daniel Carlsson, Urban Ingelsson, Viacheslav Izosimov (Semcon, SE)

5B.3 - Industrial Practice for Diagnosis Driven Yield Analysis (DDYA)
Wu Yang, Yu Huang (Mentor Graphics, US)

 

SESSION 5C - SPECIAL INDUSTRIAL SESSION - UPDATES AND ADVANCED PRACTICES FROM EDA VENDORS
Moderators: tbd

5C.1 - Cell-Aware Production Test Results from a 350nm Automotive Design
Friedrich Hapke (Mentor, DE); Marek Hustava (On Semiconductor, CZ)

5C.2 - EDA Powering the Future in IC Test
Rohit Kapur (Synopsys, US)

5C.3 - Smartscan - Reduced Pin Count Compression with Low Power Advantages- Ideal for Mixed Signal Designs
Krishna Chakravadhanula, Vivek Chickermane, Don Pearl, Subhasish Mukherjee, Robert Asher, Rajesh Khurana, Yogyata Thareja, Bassilios Petrakis (Cadence, US)

 
10:00 - 11:00 POSTERS & COFFEE BREAK
 

POSTER SESSION P2 - ANALOG/RF AND 3D IC TEST, FAULT SIMULATION AND TEST GENERATION
Moderators:
tbd


P2.1 - Efficient Minimization of Test Frequencies for Linear Analog Circuits
Mohand Bentobache (University of Bejaia, DZ); Ahcene Bounceur, Reinhardt Euler (Lab-STICC, FR); Yann Kieffer (LCIS, FR); Salvador Mir (TIMA, FR)

P2.2 - Implementing Model Redundancy in Predictive Alternate Test to Improve Test Confidence
Haithem Ayari, Florence Azaïs, Serge Bernard, Mariane Comte, Vincent Kerzerho, Olivier Potin, Michel Renovell (LIRMM, FR)

P2.3 - RF BIST and Test Strategy for the Receive Part of an RF Transceiver in CMOS Technology
Christophe Kelma, Sebastien Darfeuille, Andreas Neuburger, Andreas Lobnig (NXP, FR)

P2.4 - Hybrid Wireless Pre-Bonding Test Framework Design for 3D Stacked ICs
Unni Chandran (Intel, US); Danella Zhao (University of Louisiana at Lafayette, US); Rathish Jayabharathi (Intel, US)

P2.5 - BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing
Daniel Arumi, Rosa Rodriguez-Montanes, Joan Figueras (UPC, ES)

P2.6 - Test Generation for Circuits with Embedded Memories Using SMT
Sarvesh Prabhu, Michael Hsiao (Virginia Tech, US); Loganathan Lingappan, Vijay Gangaram (Intel, US)

 
11:00 - 12:30 SESSIONS 6A, 6B, 6C
 

SESSION 6A - COMPUTATIONAL APPROACHES TO TEST
Moderators: tbd

6A.1 - Information-Theoretic Syndrome And Root-Cause Analysis For Guiding Board-Level Fault Diagnosis
Fangming Ye (Duke University, US); Zhaobo Zhang (Huawei Technologies, US); Krishnendu Chakrabarty (Duke University, US); Xinli Gu (Huawei Technologies, US)

6A.2 - A Mutual Characterization Based SAR ADC Self-Testing Technique
Hao-Jen Lin (National Taiwan University, TW); Xuan-Lun Huang (ITRI, TW), Jiun-Lang Huang (National Taiwan University, TW)

6A.3 - Extracting Device-Parameter Variations Using a Single Sensitivity-Configurable Ring Oscillator
Yuma Higuchi, Ken-ichi Shinkai, Masanori Hashimoto (Osaka University, JP); Rahul Rao, Sani Nassif (IBM, US)

 

SESSION 6B � PANEL - CURRENT TESTING: DEAD OR ALIVE?
Organizer: Hans Manhaeve (Ridgetop Europe, BE)

Panelist: tbd

 

SESSION 6C - EU PROJECT INFORMATION 2
Moderators: tbd

6C.1 - Information of EU Research Program
Speaker to be confirmed

6C.2 - RELY � Design for Reliability of SoCs
Domenik Helms (OFFIS institute for information technology, DE)

6C.3 - DeSyRe: On-Demand System Reliability
Rishad Shafik (Bristol University of Technology, UK)

6C.4 - MASTER_3D: Manufacturing Solutions Targeting Competitive European Production in 3D
Brigitte Descouts (STMicroelectronics, FR)

 
12:30 - 14:15 LUNCH
 
14:15 - 15:45 SESSIONS 7A, 7B, 7C
 

SESSION 7A - EMBEDDED TUTORIAL
Moderators: tbd

7A.1 - Reconciling the Dichotomy Between IC Testing and Security
Ozgur SinanogluI (New York University of Abu Dhabi, UAE), Ramesh Karri (Polytechnic Institute of New York University, US), Yiorgos Makris (University of Texas, Dallas, US)

 

SESSION 7B - EMBEDDED TUTORIAL
Moderators: tbd

7B.1 - Semiconductor Failure Modes and Mitigation for Critical Systems
Hans Manhaeve, Esko Mikkola (Ridgetop Europe, BE)

 

SESSION 7C - EMBEDDED TUTORIAL
Moderators: tbd

7C.1 - Approximate Computing: An Emerging Paradigm for Energy-Efficient Design
Jie Han (University of Alberta, CA), Michael Orshansky (University of Texas, Austin, US)

 
15:30 - 23:30 SOCIAL EVENT & DINNER
 
May 30, 2013 (Thursday)
 
8:30 - 10:00 SESSIONS 8A, 8B, 8C
 

SESSION 8A - MEMORY RELIABILITY AND REPAIR
Moderators: tbd

8A.1 - Error Correction Schemes with Erasure Information for Fast Memories
Valentin Gherman, Samuel Evain (CEA-LIST, FR)

8A.2 - Reducing Power Dissipation in Memory Repair for High Defect Densities
Panagiota Papavramidou, Michael Nicolaidis (TIMA, FR)

8A.3 - Analyzing SRAM Resistive-Open Defects Under the Effect of Process Variability
Elena Ioana Vatajelu, Alberto Bosio, Luigi Dilillo, Patrick Girard, Aida Todri-Sanial, Arnaud Virazel (LIRMM, FR); Nabil Badereddine (Intel, FR)

 

SESSION 8B - PHD STUDENT WORK-IN-PROGRESS PAPERS
Moderators: tbd

8B.1 - Towards a New Approach for Handling Hard Faults in Register Files by Means of a Software-Based Register Re-Allocation
Sebastian Mueller, Mario Schoelzel, Heinrich VierhausI (BTU Cottbus, DE)

8B.2 - A New Method for Control Flow Error Detection Using the Debug Interface
Du Boyang, Matteo Sonza Reorda, Luca Sterpone (Politecnico di Torino, IT)

8B.3 - Modular Test Framework: From Component Test to Production Test
Kristian Trenkel, Ulrich Heinkel (Chemnitz University of Technology Commitment, DE); J�rg Tremmel, Florian Spiteller (iSyst Intelligente Systeme GmbH, DE)

 

SESSION 8C � VENDOR PRESENTATION SESSION - ADVANCED TEST SOLUTIONS
Moderators: tbd

8C.1 - Cost-Effective Partial Scan Automation at RTL
Chouki Aktouf (DeFacTo Technologies, FR)

8C.2 - ATE Solutions to 3D-IC Test Challenges
Scott Chesnut, Bob Smith, Cros Florent, Nambur Lakshmikanth (Advantest, US)

8C.3 - Creating Structural Patterns for At-speed Testing
Teresa McLaurin (ARM, US)

 
10:00 - 11:00 POSTERS & COFFEE BREAK
 

POSTER SESSION P3 - WORKSHOP-TYPE/WORK-IN-PROGRESS/EU-PROJECT INFORMATION
Moderators: tbd

P3.1 - Design and Performance Characteristics for 10 Gbps Burst-Mode Clock/Data Recovery
David Keezer, Carl Gray (Georgia Institute of Technology, US)

P3.2 - Visualization and Debug of Topological Quantum Computers
Alexandru Paler (University of Passau, DE); Simon Devitt, Kae Nemoto (National Institute of Informatics Tokyo, JP); Ilia Polian (University of Passau, DE)

P3.3 - RTN Variation Tolerant Screening Test Using Accelerated Margin Shifts for Nano-Scaled SRAM
Worawit Somha, Hiroyuki Yamauchi (Fukuoka Institute of Technology, JP)

P3.4 - Fault Management Instrumentation Network based on IEEE P1687 IJTAG
Konstantin Shibin, Artur Jutman, Sergei Devadze (Tallinn University of Technology, EE)

P3.5 - Analog Measurements based on Digital Test Equipment for Low-Cost Testing of Analog/RF Circuits
Francois Lefevre (NXP, FR)

P3.6 - DEMO on Wireless Testing and Test Data Compression for Complex Systems
Marie-Lise Flottes (LIRMM, FR)

 
11:00 - 12:30 SESSIONS 9A, 9B, 9C
 

SESSION 9A - LOW-POWER BIST AND TIMING ISSUE
Moderators: tbd

9A.1 - New Test Compression Scheme Based on Low Power BIST
Jerzy Tyszer, Michal Filipek (Poznan University of Technology, PL); Grzegorz Mrugalski, Nilanjan Mukherjee, Janusz Rajski (Mentor Graphics, US)

9A.2 - Novel Approach to Reduce Power Droop During Scan-Based Logic BIST
Martin Eugenio Omana, Filippo Fuzzi, Daniele Rossi, Cecilia Metra (University of Bologna, IT); Chandra Tirumurti, Rajesh Galivanche (Intel, US)

9A.3 - Optimization for Timing-Speculated Circuits by Redundancy Addition and Removal
Yuxi Liu, Rong Ye, Feng Yuan, Qiang Xu (The Chinese University of Hong Kong, HK)

 

SESSION 9B � SPECIAL SESSION - STATE-OF-THE-ART OF INTER-DOMAIN SAFETY, SECURITY AND FAULT TOLERANCE
Moderators: tbd

9B.1 - Functional Safety Trends in Automotive and Industrial Systems
Riccardo Mariani (Yogitech, IT)

9B.2 - Benchmarking the Hardware Error Sensitivity of Executable Programs
Johan Karlsson (Chalmers University of Technology, SE)

9B.3 - Reliability Analysis and Modelling for Complex Silicon Devices
Dan Alexandrescu (iRoC Technologies, FR)

9B.4 - A Practical Approach to Consolidate Safety and Security in Critical Infrastructure
Mohammad Chowdhury (ABB, NO)

 

SESSION 9C � VENDOR PRESENTATION SESSION - PROCESS CHARACTERIZATION AND BOARD TEST
Moderators: tbd

9C.1 - Rapid Characterization Method for New Semiconductor Processes
Hans Manhaeve (Ridgetop Europe, BE); Esko Mikkola, Andrew Levy (Ridgetop Group Inc., US)

9C.2 - FPGA Assisted Test for Design Validation and Production Test
Jan Heiber (GOEPEL electronic GmbH, DE)

9C.3 - IP Cores Based Test of Electronic Boards
Patrice Deroux-Dauphin (Temento Systems, FR)

 
12:30 - 14:15 LUNCH
 
14:15 - 15:15 SESSION 10 - ERROR AND THREAT DETECTION AND SELF-REPAIR
Moderators: tbd
 

An Error-Detection and Self-Repairing Method for Dynamically and Partially Reconfigurable Systems
Matteo Sonza Reorda, Luca Sterpone, Anees Ullah (Politecnico Di Torino, IT) Run-time Detection of Hardware Trojan: The Processor Protection Unit J�r�my Dubeuf, David Hely (Grenoble INP, FR); Ramesh Karri (Polytechnic Institute of New York University, US)

 
15:15 - 15:45 CLOSING CEREMONY
 
More Information
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Patrick Girard  – General Chair
LIRMM
161, rue Ada
34392 Montpellier cedex 5, France
Tel.: +33-467-418-629
Fax: +33-467-418-500
Email: girard@lirmm.fr

 

 Zebo Peng – Program Chair
Dept. of Computer and Information Science
Linköping University
SE-581 83 Linköping, Sweden
Tel.: +46-13-282067
Fax: +46-13-284499
E-mail: zebo.peng@liu.se

Committees
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General Chair
P. Girard – LIRMM (FR)

Vice General Chair
S. Hellebrand – Paderborn U. (DE)

Program Chair
Z. Peng – Linköping U. (SE)

Vice Program Chair
M. Sonza Reorda – Pol. di Torino (IT)

Local Organization Chair
A. Virazel – LIRMM (FR)

Panel Chair
M. Violante – Pol. di Torino (IT)

Embedded Tutorial Chair
L. Anghel – TIMA (FR)

Student Activity Chair
J. Raik – Tallinn UT (EE)

Industrial Liaison Chair
S. Hamdioui – TU Delf (NL)

Publication Chair
G. Di Natale – LIRMM (FR)

Fringe Workshops Chair
I. Polian – Passau U. (DE)

Award Chair
M. Renovell – LIRMM (FR)

International Liaisons
South America: E. Cota – UFRGS (BR)
Asia: X. Li – CAS (CN)
South Pacific: A. Osseiran – ECU (AU)
North America: A. Singh – Auburn U. (US)
MENA: O. Sinanoglu – NYU (UAE)

Topic Chairs
B. Becker – Freiburg U. (DE)
L. Carro – UFRGS (BR)
K. Chakrabarty – Duke U. (US)
H. Kerkhoff  – Twente U. (NL)
E. Larsson – Lund U. (SE)
C. Metra – Bologna U. (IT)
S. Mir – TIMA (FR)
J. Rivoir – Advantest (DE)
J. Tyszer – Poznan Tech. U. (PL)
B. Vermeulen – NXP Semiconductors (NL)

Test Spring School Chairs
P. Prinetto – Pol. di Torino (IT)
H.-J. Wunderlich – Stuttgart U. (DE)

Organizing Committee – LIRMM (FR)
Audio/Visual – A. Todri
Proceedings – L. Latorre
Publicity – L. Dilillo
Registration – S. Bernard
Test Spring School – M. Comte
Web – A. Bosio

Steering Committee
Chair: H.-J. Wunderlich (DE)
L. Anghel (FR)
D. Appello (IT)
B. Becker (DE)
J. Figueras (ES)
P. Girard (FR)
P. Harrod (UK)
L. Huertas (ES)
H. Manhaeve (BE)
E. J. Marinissen (BE)
Z. Peng (SE)
P. Prinetto (IT)
M. Renovell (FR)
M. Sonza Reorda (IT)
Y. Zorian (US)

For more information, visit us on the web at: http://www.ieee-ets.org

The 18th IEEE European Test Symposium (ETS 2013) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

PAST CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

TTTC 1ST VICE CHAIR
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

SECRETARY
Joan FIGUERAS
UPC Barcelona Tech - Spain
Tel. +
E-mail figueras@eel.upc.edu

ITC GENERAL CHAIR
Doug YOUNG
BVC Industrial - USA
Tel. +1-602-617-0393
E-mail doug0037@aol.com

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc.- USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Athens
- Greece
Tel. +30-210-7275145
E-mail dgizop@di.uoa.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
Tel. +33-4-6741-8501
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc.- USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
Krish CHAKRABARTY
Duke University - USA
Tel. +1-
E-mail krish@ee.duke.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL ACTIVITIES
Patrick GIRARD
LIRMM – France
Tel.+33 467 418 629
E-mail patrick.girard@lirmm.fr

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
Tel. +81 743 72 5221
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc.- USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com