MCM Testing

Technical Activity Committee on SiP and 3D IC Testing

TAC Chair:  Yervant ZORIAN,

All aspects of SiP and 3D IC testing including but not limited to:

  • wafer level, die level and stack level testing; known-good die technology;
  • Through Silicon Via fault models and tests;
  • temporary pressure- based and fixed contact-based carrier test;
  • known-good die testability approaches;
  • mechanical and contactless substrate testing;
  • SiP and 3D IC yield models;
  • ATE for SiP testing;
  • assembled module level test, testability, diagnosis and repair;
  • SiP and 3D IC level BIST;
  • testing printed circuit boards with SiPs and/or 3D ICs.